复合终端下n-Ga2O3异质肖特基二极管的结构设计及优化

Design and optimization of the structure for n-Ga2O3 Schottky barrier diode with composite terminations

  • 摘要: 氧化镓(Ga2O3) 作为一种新型的超宽禁带半导体材料,具有高达4.8 eV的禁带宽度和8 MV/cm 的临界击穿场强,这一特点很好地匹配了功率器件的性能要求。但是由于氧化镓的p型掺杂技术的缺失,氧化镓同质结器件的实现较为困难。基于此,本文提出采用p-NiO/n-Ga2O3异质结所构成的结势垒肖特基二极管(Junction Barrier Schottky, JBS),并与场板(Field Plate, FP)及阶梯型终端(Mase)进行复合,以提升其性能。为了对器件设计及制备提供理论指导,应用TCAD仿真软件对其进行了仿真研究。研究发现,与基础肖特基二极管(Schottky Barrier Diode, SBD)相比,采用复合终端的SBD的击穿电压由887 V增加至3069 V,同时正向导通电阻由3.975 mΩ·cm2略微增加至5.395 mΩ·cm2。此外,本文探讨了 p-NiO 掺杂浓度和厚度对器件性能的影响。结果证明,复合终端结构有效改善了器件的反向击穿性能,并且为器件性能的优化提供了理论指导。

     

    Abstract: Gallium oxide (Ga2O3), as a novel ultra-wide bandgap semiconductor material, possesses a bandgap of up to 4.8 eV and a critical breakdown field strength of 8 MV/cm, making it highly satisfy the requirements of power devices. However, the lack of p-type doping technology in Ga2O3 poses significant challenges to the realization of Ga2O3 homojunction devices. To address this problem, this study proposes a Junction Barrier Schottky (JBS) diode based on a p-NiO/n-Ga2O3 heterojunction, combined with field plates (FP) and mesa terminations, to enhance the DC performance of this device. TCAD simulation software was employed to provide theoretical guidance for the device design and fabrication. The results indicate that compared to a basic Schottky barrier diode (SBD), the breakdown voltage of the SBD with composite terminations increases from 887 V to 3069 V, with a slight increase in the forward conduction resistance from 3.975 mΩ·cm² to 5.395 mΩ·cm². Furthermore, the influence of p-NiO doping concentration and thickness on device performance was investigated. The present work demonstrats that the composite terminal structure effectively improves the reverse breakdown characteristics and provides theoretical insights for optimizing device performance.

     

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