区域选择性原子层沉积的研究现状与发展趋势

Research Status and Development Trend of Area Selective Atomic Layer Deposition

  • 摘要: 近年来,随着制造技术进入原子级时代,纳米制造技术得到了显著发展。然而,随着制造尺寸的逐步缩小,传统的“沉积-光刻-蚀刻”工艺在精度、效率及成本等方面面临前所未有的挑战。区域选择性原子层沉积技术因能够在特定区域实现纳米尺度的高效、精确和可控沉积,被认为是替代传统工艺的潜在技术之一。本文从区域选择性原子层沉积的基本原理出发,综述了其工艺开发现状,简要介绍了主要应用领域,并对该技术的未来发展趋势进行了展望。

     

    Abstract: In recent years, with manufacturing technology advancing into the atomic age, significant progress has been achieved in nano-manufacturing technologies. However, as the dimensions of manufacturing continue to decrease, the conventional “deposition-lithography-etching” nanofabrication process faces unprecedented challenges in terms of precision, efficiency, and cost. Given its advantages of high efficiency, precise control and selective deposition in targeted regions, area selective atomic layer deposition has emerged as a highly promising alternative to the traditional “deposition-lithography-etching” process. Based on the principles of area selective atomic layer deposition, this paper reviews the current status of its development, outlines its primary applications, and provides an outlook on the future advancements of this technology.

     

/

返回文章
返回