Abstract: Integrated circuit is the infrastructure of the information society. The core process of integrated circuit manufacturing is photolithography. The localization of photoresist is an important guarantee for the development of integrated circuit industry in China. This paper introduces the application of a domestic negative photoresist HTKN601 in the processing of Surface Acoustic Wave（SAW） devices. The photoresist lift-off technology（Lift-off） shows a unique and well-controlled after the exposure and development process. “Undercut” the contour, which can form a fine metal pattern after peeling. At the same time, through the selection and optimization of resin and formula, the residual problem after degumming is further improved. This technology can be used to produce chips with a line width of less than 0.25μm, which is a vital and valuable technology in the micron and sub-micron range.