Abstract: In the ever-evolving landscape of electronic technology, the strides made in miniaturization have been monumental. However, this advancement has ushered in a new challenge that looms large on the horizon: heat dissipation.Hexagonal boron nitride composites emerge as a game-changer in microelectronics, boasting mechanical excellence, high thermal conductivity, stability, and insulation. This article delves into the current research status across two key aspects: the preparation of hexagonal boron nitride nanosheets and the enhancement of thermal conductivity in these composites.