Abstract: Silver, a precious metal material, is extensively utilized in various domains such as electronics and biomedicine due to its superior electrical conductivity, thermal conductivity, optical transmittance, and antibacterial properties. At present, research on high-molecular composite materials has garnered significant attention from the scientific community. This area of study emphasizes the integration of high-molecular materials with functional additives to improve or optimize the overall performance of the materials, including but not limited to high -temperature resistance, chemical corrosion resistance, insulation, thermal insulation, and antibacterial characteristics. This review article explores the application of silver materials and functional additives in enhancing the critical performance of high-molecular materials such as PI, PEEK, and EP. It analyzes the enhancement of these materials in terms of antibacterial properties, electrical conductivity, thermal management (including heat dissipation and thermal conductivity), heat resistance, and mechanical tensile strength. By examining existing research and providing commentary on recent advancements, this article aims to offer valuable insights and references for researchers in related fields.